Abstract: A series of melt-processable polyimide(PI)films are developed to solve the problem of the infusibility of the commerciallv available PI films. Seven PI films (PI-1~PI-7)are synthesized form an asymmetrical aromatic dianhydride, 2, 3, 3', 4'-oxydiphmalic diallhydride(a-ODPA)and various aromatic diamines via a chemical imidization procedure. The structure-propety relationships of the PIs are investigated. It is shown that the asymmetrical stnlctllre of a-ODPA giVes the derived PIs a good themoplasticity and the PI films could be adhered via a heat-sealing procedure, The adhesive strength between the PI films could reach a maximum value of 660 N/m. In addition, the prepared PI films show good themlal and mechanical pmperties with 5%weight loss temperatures over 500℃, glass transition tempemtures higher man 230℃ and tensile strengths over 89 MPa.