重离子源类别对SiC MOSFET单粒子效应的影响

Influence of heavy ion source type on single event effect of SiC MOSFETs

  • 摘要: SiC金属−氧化物半导体场效应晶体管(MOSFET)作为第三代航天器用半导体器件,在应用前须经过抗单粒子效应试验评估。文章探究重离子加速器恒定式和脉冲式束流源这两种不同类别的辐照源对SiC MOSFET单粒子效应的影响。试验结果表明两种束流源对SiC MOSFET漏电退化影响不同。采用TCAD对SiC MOSFET单粒子效应进行仿真的结果显示,当2个离子在相差100 ps的间隔时间内轰击器件时,离子间会发生相互作用,使得电场增强,对器件的栅氧化层造成损伤。尽管这种相互作用对器件发生单粒子烧毁的阈值电压无显著影响,但漏电退化现象有明显差异。研究结果可为SiC MOSFET的单粒子效应试验提供参考。

     

    Abstract: SiC metal-oxide-semiconductor field-effect transistors (MOSFETs), serving as the third generation of semiconductor devices for spacecraft, must undergo anti-single event effect (SEE) radiation tests before their application. The impacts of constant and pulsed beam sources of heavy ion accelerators on SEE of SiC MOSFETs were investigated in this article. The experimental results show that the two types of beam sources have different effects on the leakage degradation of SiC MOSFETs. TCAD was used for simulating SEE of SiC MOSFETs. The simulation reveals that when two ions bombard the device at intervals of 100 ps, interaction between the two ions occurs, resulting in an enhanced electric field that may damage the gate oxide layer. Although the interaction has no significant effect on the threshold voltage for single event burnout, there is a noticeable difference in leakage degradation. This research may provide a reference for subsequent SEE experiments on SiC MOSFETs.

     

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