Abstract: Due to the high cost of composite phase change heat sink in existing electronic devices, a low-cost and light-weight phase change materials (PCM) heat sink design was proposed, in which the thermal beads were only arranged in the main heat conduction direction, and the specific surface area was increased by drilling holes. For the PCM heat sink of an electronic device module, the influence of the thickness, arrangement along the heat transfer path, the perforation diameter and porosity of the thermal beads, on the heat transfer were designed and simulated. Compared with the 8% expanded graphite-high-carbon alcohol composite PCM heat sink, the proposed PCM heat sink has little effect on the chip temperature in the noncritical junction temperature state in that the temperature difference does not exceed 3.2 ℃, and the mass increases by only 5%. In addition, the cost is only one-third of the composite phase change heat sink. The research may provide a way for the PCM heat sinks to reduce their cost and popularize their use.