Abstract: Vapor chamber, as an efficient heat dissipation component, has been widely used in the thermal management of electronic devices. The structure of its liquid absorbing wick is the key to efficient heat dissipation of vapor chamber. In this study, inspired by the transpiration of plant leaves in nature, the porous wick was made by powder sintering to imitate the leaf veins and mesophyll tissues. Two wick structures with polygonal edge (VC-B) and polygonal (VC-G) as internal support of vapor chambers were designed for comparative research to investigate the influence of liquid filling rate and cooling water temperature on the heat transfer performance. The results show that the VC-B vapor chamber has the optimal heat transfer performance with a filling rate of 60%, and a maximum bearable heat flux of 120 W/cm², while that VC-G vapor chamber can bear 130 W/cm² at a cooling water temperature of 10 ℃. At lower cooling water temperatures, the heat transfer capacity was strong, but the temperature uniformity was poor. These bionic vein vapor chambers may provide an effective solution for heat dissipation of electronic devices with high power and high heat flux.