Abstract:
In view of the demand for the solar array of high volume specific power for the microsatellite, a solar array with flexible printed circuit(FPC) is designed. The solar cells, the FPC and the substrate are integrated, with advantages of thin thickness and light weight. The environmental adaptability is evaluated by the thermal cycling test. The X-ray detection results show that the thermal stress in the solar array at the joint between the solder pad and the copper clad layer is relatively large, signifying a risk of fracture of the solder pad fromthe copper clad layer under the condition of the long-term high and low temperature alternation. Some suggestions are given to improve the thermal deformation resistance of the FPC on the solar array, which may serve to provide a reference for the reliability design of solar arrays.