Abstract: The grounding network assembled during the satellite AIT phase is closely related with the quality of the EMC performance. This paper reviews the present status of the conductive copper foil grounding performance and analyzes the degradation mechanism of the conductive copper foil grounding performance. By carrying out a humiture acceleration test, it is found that the conductive adhesive degradation plays a dominant role. Besides, the spot-welding can obviously improve the grounding performance of the copper foil so as to meet the demands of the satellite mission.